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Green and environmentally friendly new enterprise of polymer composite materials
KH7130(EG)
The company's main wafer semiconductor class rough polishing, fine polishing materials, mainly developed for consumer electronics, precision optics, semiconductors (silicon wafers, wafers, gallium arsenide, indium phosphide, silicon carbide, etc.) industry fields.
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The damping fabric product series is made of non-woven fabric and special polyurethane composite, with uniform product foam holes and a delicate velvet feel, suitable for precision polishing of silicon wafers, germanium wafers, and other products.
Classification:
Keywords: PU composite material | polishing abrasive material
Product Description
The damping fabric product series is made of non-woven fabric and special polyurethane composite, with uniform product foam holes and a delicate fluff feel, suitable for precision polishing of silicon wafers, germanium wafers, and other products.
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