Products
Green and environmentally friendly new enterprise of polymer composite materials
KH8713N
The company's main wafer semiconductor class rough polishing, fine polishing materials, mainly developed for consumer electronics, precision optics, semiconductors (silicon wafers, wafers, gallium arsenide, indium phosphide, silicon carbide, etc.) industry fields.
Here is the title one h1 placeholder text
The product series is made of high-density non-woven fabric and special polyurethane, featuring high hardness, low compression rate, high flatness, and resistance to acids and alkalis. It is paired with strong aluminum oxide polishing liquid for rough polishing of sapphire substrate products. This product can perfectly replace imported polishing pads and is the first choice for enterprises to reduce costs and increase efficiency.
Classification:
Keywords: PU composite material | polishing abrasive material
Product Description
The product series is made of high-density non-woven fabric and special polyurethane, featuring high hardness, low compression rate, high flatness, and acid and alkali resistance. It is paired with strong aluminum oxide polishing liquid for rough polishing of sapphire substrate products. This product can perfectly replace imported polishing pads and is the first choice for enterprises to reduce costs and increase efficiency.
Previous Page
Next Page
Previous Page
Next Page
Related
