KH8007(SP)
The company's main wafer semiconductor class rough polishing, fine polishing materials, mainly developed for consumer electronics, precision optics, semiconductors (silicon wafers, wafers, gallium arsenide, indium phosphide, silicon carbide, etc.) industry fields.
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The product series is made of high-density non-woven fabric and special polyurethane combined with PET, featuring high hardness, low compression rate, high flatness, and acid and alkali resistance. It is used for rough polishing of indium antimonide products in the infrared military industry, effectively replacing imported polishing pads and filling the domestic gap.
Classification:
Keywords: PU composite material | polishing abrasive material
Product Description
The product series is made of high-density non-woven fabric combined with special polyurethane and PET, featuring high hardness, low compression rate, high flatness, and acid and alkali resistance. It is used for rough polishing of indium antimonide products in the infrared military industry, effectively replacing imported polishing pads and filling the domestic gap.
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