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Green and environmentally friendly new enterprise of polymer composite materials
CP series 0.8-4.0MM various Specification white grinding leather
The company's main wafer semiconductor class rough polishing, fine polishing materials, mainly developed for consumer electronics, precision optics, semiconductors (silicon wafers, wafers, gallium arsenide, indium phosphide, silicon carbide, etc.) industry fields.
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Classification:
Keywords: PU composite material | polishing abrasive material
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