Products
Green and environmentally friendly new enterprise of polymer composite materials
KH8713S
The company's main wafer semiconductor class rough polishing, fine polishing materials, mainly developed for consumer electronics, precision optics, semiconductors (silicon wafers, wafers, gallium arsenide, indium phosphide, silicon carbide, etc.) industry fields.
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The product series is made of high-density non-woven fabric and special polyurethane, featuring high hardness, low compression rate, high flatness, and resistance to strong oxidants, suitable for coarse polishing of silicon carbide substrates.
Classification:
Keywords: PU composite material | polishing abrasive material
Product Description
The product series is made of high-density non-woven fabric and special polyurethane, featuring high hardness, low compression rate, high flatness, and resistance to strong oxidants, suitable for rough polishing of silicon carbide substrates.
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